Technology Our products
{"Image DocumentName": "Technology Our products", "Image ImageDescription": "From Single-sided up to 28 layers (thickness 6.0 mm max.) HDI- and SBU-Multilayer (4 + core + 4 max.) Blind-, buried- and microvias. Stacked vias. HF / Impedance-control (POLAR) Halogen-free circuit boards. Copper up to 400 \u00b5m. Pressfit technology. Aluminium based PCB. Flex / flex-rigid (also HDI) Different-coloured soldermasks. Via Hole Plugging and Copper Hole Filling. RoHS / UL. Production according to customer\u2018s requirements. Our products.", "Image XResolution": "37", "Image YResolution": "37", "Image ResolutionUnit": "Pixels/Centimeter", "Image Software": "SlidePlayer", "Image YCbCrPositioning": "Centered"}