Hot Melt Adhesive Tape - The hot melt adhesive has good electrical conductivity and is packaged by a dual interface smart card. Excellent adhesion to PVC, ABS, PC, FR-4 and other materials.  This product is a large molecular weight structural hot melt tape. The superior cohesion ensures that there is no structural breakage in the thrust and bending tests after bonding, while maintaining a balanced bond strength with the chip and the card base. Meets the requirements of IC7816 for chip package fastness.  It is suitable for thermal packaging of dual interface bank cards and social security cards.
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