Electronics Assembly & Interconnect Levels
{"Image DocumentName": "Electronics Assembly & Interconnect Levels", "Image ImageDescription": "FPC. Direct Chip Attachment to FPC. FPCA. Module Assembly & Chassis Integration. End Product. Flexible printed circuit fabrication. Wire Bond or Flip Chip attachment to flexible printed circuit. A fully assembled FPC containing IC\u2019s, resistors, capacitors, diodes, FPCA mounted on chassis with various types of hardware. Functional System. MFLEX Confidential.", "Image XResolution": "37", "Image YResolution": "37", "Image ResolutionUnit": "Pixels/Centimeter", "Image Software": "SlidePlayer", "Image YCbCrPositioning": "Centered"}