©VENTEC ELECTRONICS PCB Fabrication considerations: Lamination Heavy filler loading leads to differing prepreg flow characteristics at lamination; - Moderately less flow than standard prepreg materials > No fill required, therefore less flow not a process concern - Aluminum-FR4 lamination bonds materials with highly differing CTE rates; > Low/slow rates of cooling at conclusion of cure segment are advised.
{"Image DocumentName": "PCB Fabrication considerations: Lamination", "Image ImageDescription": "Heavy filler loading leads to differing prepreg flow characteristics at lamination; - Moderately less flow than standard prepreg materials. > No fill required, therefore less flow not a process concern. - Aluminum-FR4 lamination bonds materials with. highly differing CTE rates; > Low/slow rates of cooling at conclusion of cure segment. are advised. > Pin-less Lamination requires caution in tooling stack heights. If you\u2019re building multilayer constructions, rather than making straightforward single-sided circuits (And we also have customers who fabricate their own IMS laminate), you need to be aware that thermally conductive prepregs need the sort of press parameters you would use for a low-flow. You can make the resin flow, if you\u2019re quick with your heat-up and getting the pressure on. And with the right technique, you can encapsulate 2oz tracks. You have to try harder if you want to fill patterns deeper than 2oz. 21.", "Image XResolution": "37", "Image YResolution": "37", "Image ResolutionUnit": "Pixels/Centimeter", "Image Software": "SlidePlayer", "Image YCbCrPositioning": "Centered"}