Air Cavity Package Technologies
{"Image DocumentName": "Air Cavity Package Technologies", "Image ImageDescription": "Plastic Backed. For Low Energy Cavity Package. Applications like. Sensors, etc. CCD / CMOS. (Thermo-Plastic) For Vision and Optical. Sensor applications. Thermally Enhanced. Metal Backed. Eutectic & Non-eutectic applications with. high thermal transfer.", "Image XResolution": "37", "Image YResolution": "37", "Image ResolutionUnit": "Pixels/Centimeter", "Image Software": "SlidePlayer", "Image YCbCrPositioning": "Centered"}