Desired resist properties
{"Image DocumentName": "Desired resist properties", "Image ImageDescription": "Good adhesion to the substrate, uniform film thickness, easy spinning. High pattern transfer fidelity, no adhesion to the mold during seperation. Low viscosity during imprinting. Low imprint pressure and temperature. But sufficient thermal stability in subsequent processes, e.g. RIE, lift-off. High plasma etch resistance for pattern transfer into under-layers. Soluble in non-toxic solvents, deposition by spin-coating. Minimal shrinkage (for UV and thermal curable resist). Mechanical strength and tear resistance.", "Image XResolution": "37", "Image YResolution": "37", "Image ResolutionUnit": "Pixels/Centimeter", "Image Software": "SlidePlayer", "Image YCbCrPositioning": "Centered"}