38 2013-11-08 S-MINI Package (No.1) Size Lead Frame material Bonding Wire Exterior Plating Marking Method MP P/NJapanThailandJapanThailandJapanThailandJapanThailand 1SS181 2.9 x 2.5 x 1.1 mm Cu AuCu Sn-2.5Ag Pure-Sn Laser OK 1SS184 Cu AuCu OK 1SS187 Cu AuCu OK 1SS193 Cu AuCu OK 1SS226 Cu AuCu OK 1SS294 Cu AuCu OK 1SS396 Cu AuCu OK 2SA1162 Cu AuCu OK 2SC2712 Cu AuCu OK DF3A5.6F Cu AuCu OK RN1401 Cu AuCu OK RN1402 Cu AuCu OK RN1404 Cu AuCu OK
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